This project aims to develop a fully autonomous PCB fabrication system using patent pending technology.

Research Artifacts

ONSHAPE: https://cad.onshape.com/documents/3243ea1bd3589d0925adddab/w/d0fea9b32d141de691aa79d1/e/9e13614e1fd641bf752e1383?renderMode=0&uiState=6ac344239521c450e19ac77d

BOM: https://docs.google.com/spreadsheets/d/1b5MI1o8flMezqj3B9vNB6P3Z3AsRCiVpRihs46ysqLc/edit?usp=sharing

Log

Reference Artifacts

https://www.youtube.com/watch?v=yElA7GaP7SQ&t=141s

https://www.youtube.com/watch?v=PGIOS9qb7WI

https://www.youtube.com/watch?v=BuV_ikbM1Vc

Manufacturing Stages

• [x] Freeze V1 architecture. ~140 × 140 mm board, 2-layer FR4, one board thickness, one via/rivet system, mostly SMD, ~375–400 mm enclosure. Freeze the process: load → pattern A → flip → pattern B → drill → vias → paste → place → reflow.
• [ ] Build the rigid chassis and PCB datum system. Frame, central board fixture, registration pins/clamps, gantry mounting points and lower-anvil clearance. Everything depends on this coordinate system.
• [ ] Build one precision XY gantry + Z/tool carriage. Prove repeatability first with a pointer/camera. Don’t add process tools until XY/Z is reliable.
• [ ] Build the rotating PCB fixture. Automatic 0°/180° flip with deterministic indexing and no coordinate drift.
• [ ] Build the universal tool mount. Kinematic locating interface, latch, electrical contacts, optional vacuum/air. Laser, paste, P&P and future heads all reference the same datum.
• [ ] Integrate and calibrate the laser. Start with copper isolation, then holes, then board outline. Characterize power, pulse frequency, scan speed, focus, copper thickness and FR4 damage. This is where we decide whether laser-only drilling is viable.